Packaging Integration Engineer
CScale · Palo Alto, CA
Drive the package for CScale's optical semiconductor product from concept to production. Work with OSATs and foundries on interposer-based 2.5D/3D packaging, and collaborate with silicon photonics, IC design, layout, test and reliability teams to establish manufacturability and reliability.
What you'll do
- Drive the package from initial concept to production
- Help establish photonic and electronic co-design process flow
- Define integration packaging design rules, process flow and materials with OSATs
- Lead optical package development for manufacturability and reliability
- Work with foundries and OSATs on interposer process integration and packaging
Requirements
- Understanding of 2.5D and 3D packaging technologies (interposers, heterogeneous integration, high-density interconnects)
- Ability to select and manage external foundries/OSATs for interposer-based packaging
- Strong program/project management skills
- Clear communication and cross-functional collaboration
- Driven multiple 2.5D/3D high-speed packages end to end
- Experience driving packages with unconventional needs or uncommon processes
- Experience working with large OSATs and foundries on custom processes and flows
- B.Sc.+ in EE, Materials or Optics
Nice to have
- Familiarity with layout design for high-speed applications, simulation, mechanical and thermal analysis
Skills
Outlined skills are listed as required.
Full original description
CScale is a startup backed by Sutter Hill Ventures and Atreides Capital - headquartered in Palo Alto, CA. Our executive team has a demonstrated track record of building and scaling category-defining semiconductor and infrastructure businesses at companies like Broadcom, Lumentum, Tesla, Apple, Samsung, Intel, and VMware.
CScale is developing next-generation optical semiconductor solutions for the AI infrastructure market, focused on enabling true “scale-up” architectures. Our mission is to replace traditional copper interconnects with advanced fiber-optic technologies that overcome the limitations of existing optics solutions and architectures.
Duties, Deliverables, and Responsibilities
● Drive Cspeed’s package from initial concept to production
● Help establish photonic and electronic co-design process flow
● Work with OSATs to define integration packaging design rules, process flow, and materials
● Lead optical package development to establish package manufacturability and reliability
● Collaborate with cross-functional teams including silicon photonics, IC design, layout, test and reliability to drive the package/integration forward
● Work with external foundries and OSATs on process integration and packaging for interposer
Expertise, Knowledge, and Skills
● Understanding of 2.5D and 3D packaging technologies, i.e. interposers, heterogeneous integration, high-density interconnects
● Ability to select and manage external foundries/OSATs for interposer-based packaging (must understand material selection, state of the art techniques, and advanced process flows required for advanced packaging)
● Must have strong program/project management skills (i.e. set schedule, maintain it, ensure parts arrive on time in the right place, etc.)
● Clear communication, ability to work cross-functionally and interface with design, SI/PI, testing, vendors, OSATs, etc
● Bonus: Familiarity with layout design for high-speed applications, simulation, mechanical and thermal analysis
Experience, Background, and Accomplishments
● Driven multiple 2.5D/3D high-speed packages end to end, working with all roles on the packaging team (design, layout, SI/PI, test and reliability, etc.)
● Experience driving packages with unconventional needs / uncommon processes
● Experience working with large, established OSATs and foundries on custom processes and flows
● B.Sc.+ in EE or Materials or Optics